Indium10.1HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium10.1HF offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

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Indium10.1HF solder paste enables low cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.

Indium10.1HF is versatile, with a balanced set of properties:
  • Meets leading OEM standards for non-wet open resistance.
  • Oxidation barrier technology delivers strong resistance to:
    • Head-in-pillow defects
    • Graping (non-coalescence of powder particles)
  • Strong surface oxide cleaning and pad wetting during reflow ramp
  • Ultra low voiding on BGSs, CSPs, and QFNs
  • Outstanding printing performance with high transfer efficiency and low variability
  • Excellent response-to-pause

Please contact us for price and shipping information.


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