Indium10.1HF solder paste enables low cost-of-ownership to PCB assembly customers through an all-around balanced performance, including stencil printing yields, voiding, and soldering yields.
Indium10.1HF is versatile, with a balanced set of properties:
- Meets leading OEM standards for non-wet open resistance.
- Oxidation barrier technology delivers strong resistance to:
- Head-in-pillow defects
- Graping (non-coalescence of powder particles)
- Strong surface oxide cleaning and pad wetting during reflow ramp
- Ultra low voiding on BGSs, CSPs, and QFNs
- Outstanding printing performance with high transfer efficiency and low variability
- Excellent response-to-pause
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