Indium 6.4R Type 4 Sn63/Pb37 is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. One of Indium® Corporation’s preferred pastes, it is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.
Indium 6.4R exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).
Low-voiding water-soluble flux for solder paste:
Reduced largest voids, fewer voids, for BGA, CSP and bottom termination components, such as QFNs & DPAKs.
Exceptional printing process window:
Excellent response-to-pause, long stencil life, prints consistently at a wide range of speeds.
Wide reflow process window, excellent wetting on a variety of surface finishes, maintains tack over time, outstanding cleanability.
Indium6.4R flux residue is cleanable up to at least 72 hours after reflow and is best cleaned using DI water with a spray pressure of at least 40psi and a temperature of at least 40°C. These parameters are a function of board complexity and cleaner efficiency. Electrical testing should be performed after the flux residue is removed. Stencil cleaning is best performed using an automated stencil cleaning system for both stencil and misprint cleaning to prevent extraneous solder particles. Most commercially available stencil cleaners and isopropyl alcohol (IPA) work well.
Technical Data Sheet: Indium6.4R Water-Soluble Pb-Free and SnPb Solder Paste
*SDS available upon request