Description
Indium 6.6HF | Lead Free | SAC 305 | Water Wash | Solder Paste | 500g Jar
Indium 6.6HF is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response to pause. Indium 6.6HF exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs and BTCs (QFNs, D-Paks, LGAs, etc.).
Features:
- Alloy: SAC 305 (96.5Sn 3.0Ag 0.5Cu)
- Metal: 88.5%
- Mesh Size: Type 4: -400+635 (25 to 38 microns)
- Lowest voiding water-soluble flux for solder paste
- Reduced largest voids
- Fewer voids
- Minimized voiding overall
- For BGA, CSP, and bottom termination components such as QFNs
- Exceptional printing process window:
- Excellent response to pause
- Long stencil life (>8 hours in controlled environment)
- Prints consistently at a wide range of speeds
- Wide reflow process window for profiling
- Excellent wetting on a variety of surface finishes
- Maintains tack over time
- Suitable for SnPb eutectic alloys as well as Pb-free alloys
Product Data Sheet: Indium 6.6HF Solder Paste – PDS
*All of our Indium solder paste is available in 10cc & 30cc syringes, 500g jars and 600g cartridges. Each paste is also available in different mesh sizes (types). If you are interested in any of these variations please contact us at 416-578-8070 or [email protected] to place a specialized order.
