Description
Indium10.1 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing
temperatures required by SnAgCu and other Pb-free alloy systems favored by the electronics industry to replace Pb-bearing
solders. Indium10.1 offers exceptional stencil print transfer efficiency to work in the broadest range of processes. In addition,
the high oxidation resistance of Indium10.1 virtually eliminates incomplete coalescence (graping) of small deposits and the
head-in-pillow defect. Indium10.1 also offers extremely low, large ground-plane voiding found in QFN components.
Indium 10.1 Solder Paste versatile with a balanced set of properties:
- Meets leading OEM standards for non-wet open resistance.
- Oxidation barrier technology delivers strong resistance to:
- Head-in-pillow defects
- Graping (non-coalescence of powder particles)
- Strong surface oxide cleaning and pad wetting during reflow ramp
- Ultra low voiding on BGSs, CSPs, and QFNs
- Outstanding printing performance with high transfer efficiency and low variability
- Excellent response-to-pause
Cleaning: Indium 10.1 is designed for no-clean applications; however, the flux can be removed, if necessary, by using a commercially available flux residue remover. Stencil cleaning is best performed using isopropyl alcohol (IPA) as a solvent. Most commercially available non-water-based stencil cleaners work well.
Product Data Sheet: Indium10.1 Pb-Free Solder Paste
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